IPC J-STDE, Requirements for Soldered Electrical and Electronic Assemblies released, updated for all three classes of construction. Requirements for. Soldered Electrical and Electronic. Assemblies. IPC J-STD- E April Supersedes Revision D February IPC J-STDE April Supersedes Revision D February JOINT INDUSTRY STANDARD Requirements for. Soldered Electrical and Electronic.
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Training is provided to personnel with ass igned responsibilities in the development, implementation. There shall [AIP] be positive contact o f the wire w ith at least 001r corner of the post Figure and shall  meet the requirements of Table Under-fill or staking material Note1: AIJ leads shall  have stress relief when the component is clip or adhesive mounted or otherwise constrained.
A documented aud it plan is defined to monitor process characteristics an dJor output al a prescribed frequency g. Notes 2 ,3 an d Figu n-std Circu mferential wetting of lead and barrel on sol der desti nation side Percentage of original land area covered with wetted solder on sold er destination side.
The clinch should be sufficient to provide mechanical restraint during the dering process.
Side jolnt length and end overlap 3. After lhey are assembled and sol dered the boards are not conformal coatedleaving the solder joint and soldered land uncoated 53 IPC – 6. Current limiti ng soldering equipment manufactured to EN Pe rcentage 01 land area covered w ith wetted solder.
A system is in place to initiate corrective aclion for the occurrence of process iodicators.
Such mechanical securing should prevent movement between the parts of the connection during the solderi ng operatio n. If usedco ntrolled accelerated or slo wed ramp cooling shall [NI] be in accordance with documented procedures. It is not possible 10 in cJ ude all of those who assisted in the evolution of this standard. SS all o[ the possible componellts and p 1Vduct design combinatiol1 s, e. Side joint length 2.
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
This requirement may jj-std eliminated when visible residue has been identificd as benign through laboratory analysis or other means. Automatic or manual mcthods for dross removal are acceptable 4. Lower guide slol 3. Wetting is evident Note 4: Fails to comply with wetting criteria of 4. Wetting is evidenl Note 5: Solder paste shall  also meet the requirements of 3.
A fi lI et shall [N1P2D3] be formed along the surfaces of contact between the wire and terminal b. End joint width 6. Foster Defense Acquisition Inc. AFigure Terminal Mounting – Electrical 1. J 2 Heat Shrinkable Soldering Devices Not a visualfy inspeClable atlribule. The orientation of the clinch relative to any conductor is optional.
J-STDE: Requirements for Soldered Electrical and Electronic Assemblies
For assemblies with mixed land widthsthe grealer magnification may be used for the entire assembly. Unspecified parameter or variable in size as determined by design Note 3: Base ‘ Accept Defect Wire violates minimum Defect electrica l clearance. When another test method or ftux is used see 3. The end of the part is defined to include any coatingsolder sealsolder or weld beador any other extension.
Contain simple simplified language? Disturbed solder connections C. This configuralion is not applicable for any applicalion requiring protection from harshhumid. See Note 4Table 7. Radial s plit 3 max 2. Wire insulation shall not [AIP] enter the base o f post of termina l.
Follow the requirements of 4.